Equipment Functionalization Technologies

Industrial Robots

• UR 10e
• UR 20
• ABB IRB 660
• KUKA KR 15
• KUKA KR 150 R 2700 extra

Motion Systems

• Modified BZT PFE 510-PX
• Modified E3D Toolchanger

Tools and End Effectors

• Robotiq Screw Solution
• Robotiq Hand-E
• High-precision micro-dosing systems based on high-speed piezo technology (Vermes MDS 3250+FC): For use with liquids of high to very high viscosity up to 2,000 Pas; contactless dosing
• Cryogenic device
• In-house developments of WEAM, FEAM, AuCA in various versions

Additive Manufacturing

• Ultimaker 5s
• Raise Pro 2
• Bambu lab X1c
• Stoneflower 4.0
• Formlabs Form 3BL

Basic Equipment for Microbiological Laboratory Level BSL-2

• Climate test chamber -42 °C / +180 °C
• Cooling and freezing unit
• Autoclave Systec DX-65
• Preparation table
• Biomechanical safety workbench
• Fume hood
• Cutting table
• Vibration-damped test bench
• Visualization hardware and workstation

Mechanical Testing

• Tensile, compression, and torsion material testing machine: Combined tests up to 10 kN and 200 Nm; temperature chamber -40 °C to 200 °C; media bath; static and cyclic tests up to approx. 1 Hz
• Tensile-compression testing machine: Tests up to 20 kN; temperature chamber -80 °C to 250 °C
• Servo-pneumatic tensile-compression testing machine; tests up to 20 kN; cyclic tests up to 30 Hz; tensile testing machine Zwick/Roell
• Tekscan 471 x 471 mm: System for pressure distribution analysis

Thermal Testing

• Differential Scanning Calorimetry (DSC): DSC 3+ from Mettler Toledo for temperature ranges from -100 to 700°C to analyze thermally induced transformation processes (transformation temperatures, heat capacity, crystallization, etc.); protective atmosphere N, heating/cooling rates from 0.02 to 50K/min

Rheological Testing

• Rheometer (Thermo Scientific™ HAAKE™ MARS)

Optical Testing

• GOM PONTOS: Dynamic capture of dynamic or quasi-static movements/deformations, e.g., for creating motion models
• GOM TRITOP Deformation: Portable, optical 3D coordinate measuring machine
• Thermal imaging analysis (128 x 96 pixels) in the temperature range of 10 °C to 350 °C
• LEA O2C: Diagnostic device for determining blood flow parameters
• Polytec PSV4003D: 3D laser scanning measurement system for capturing dynamic properties of components, e.g., for verifying numerical models
• Laser profile scanner (Micro-Epsilon scanCONTROL 2960-10/BL): Precise and fast profile capture and surface measurement; measurement range (X-axis): 3-10 mm, 1280 points/profile; Z-resolution: 1 µm, maximum profile frequency: up to 2 kHz
• µCT device: Micro- and nanofocus tube (detail detectability: 0.2 – 0.3 µm); maximum sample size: Ø 260 mm, height 420 mm; testing under load up to 1000 N
• Scanning electron microscope with EDX
• Various stereo and incident light microscopes
• Testing technology and software

Electrical Testing

• Eddy current measurement (EddyCus Scanner): Specialized solutions for non-destructive and contactless testing of conductive and very poorly conductive layers and composite materials; frequency range 10 kHz to 100 MHz; minimum resolution of 0.1 mm in X and Y directions; measurement duration for 200mm² (scan resolution of 500 µm): 7 min; frequency sweep for up to 256 frequencies for analytical evaluation

Design, Modeling, and Simulation

• High-performance design and calculation servers
• ABAQUS
• ANSYS: Structural mechanical calculations
• AnyBody: Structural mechanical calculation, e.g., for implant-bone interface
• CATIA, ProEngineer, Autodesk Inventor, Geomagic Freeform, SolidWorks, Rhinoceros/Grasshopper: Design
• Comsol Multiphysics: Mechanical, thermal, and acoustic structure and flow simulation
• FEMTools: Structural mechanical calculations, comparison, optimization
• Hypermesh
• LSDYNA
• Matlab, MathCad, Mathematica
• Magics: Generation of regular cellular structures
• National Instruments
• OptiSLang
• Origin
• TOSCA: Structural optimization of mechanically stressed components
• VG Studio Max